Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions.

Tong Hong Wang Yi-Shao Lai Yu-Cheng Lin Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. 132-139 2008 48 Microelectron. Reliab. 1 https://doi.org/10.1016/j.microrel.2007.02.011 db/journals/mr/mr48.html#WangLL08