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ORCIDYida Li 0004
Person information
- affiliation: Southern University of Science and Technology, Shenzhen, Guangdong, China
Other persons with the same name
- Yida Li — disambiguation page
- Yida Li 0001
![[0000-0002-6412-7129]](https://dblp.uni-trier.de/img/orcid-mark.12x12.png "0000-0002-6412-7129")
— Hunan University, Changsha, Hunan, China - Yida Li 0002 — Nanjing University of Aeronautics and Astronautics, Nanjing, China
- Yida Li 0003 — University of Electronic Science and Technology of China, Chengdu, China
- Yida Li 0005 — China University of Petroleum, Beijing, China
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2020 – today
- 2026
[j8]Jin Wang, Moxiao Lou, Zhengke Yang, Zhixiong Li, Jiamin Li, Yida Li, Jerald Yoo, Longyang Lin:
AdaPIM: A CIM-Based General-Purpose Vision Accelerator With Adaptive Inter-Macro Parallelism and Multi-Level Feature Reuse. IEEE J. Solid State Circuits 61(8): 4399-4413 (2026)- [c12]Zhen Kong, Weirong Dong, Junjie He, Zhengke Yang, Jun Lan, Yida Liang, Jiamin Li, Yida Li, Longyang Lin:
Mitigating Conductance Drift via In-Situ Calibration for Reliable RRAM-Based CIM Edge Inference. ISCAS 2026: 4212-4216 - [c11]Junjie He, Zhen Kong, Yida Liang, Humiao Li, Yida Li, Jiamin Li, Longyang Lin:
A 40-nm Resilient MLC RRAM Macro with Self-Referenced Time-Based Readout and 3-Bit Interleaved ECC Achieving 0.22 pJ/bit Read Energy. ISCAS 2026: 4548-4552 - [c10]Zhengke Yang, Haofeng Yu, Xiao Liu, Zhen Kong, Humiao Li, Liang Ran, Zhichao Lyu, Xinhe Feng, Liang Zhao, Yida Li, Jiamin Li, Feichi Zhou, Longyang Lin:
7.8 A 55nm Intelligent Vision SoC Achieving 346TOPS/W System Efficiency via Fully Analog Sensing-to-Inference Pipeline. ISSCC 2026: 126-128 - [i1]Weirong Dong, Kai Zhou, Zhen Kong, Zhengke Yang, Quan Cheng, Haoyuan Li, Junkai Huang, Jun Lan, Yida Li, Masanori Hashimoto, Longyang Lin:
VeRA+: Vector-Based Lightweight Digital Compensation for Drift-Resilient RRAM In-Memory Computing. CoRR abs/2603.26016 (2026) - 2025
- [c9]Jin Wang, Moxiao Lou, Zhengke Yang, Ruijie Peng, Humiao Li, Weirong Dong, Haoran Lyu, Yida Li, Jiamin Li, Hao Yu, Jerald Yoo, Longyang Lin:
A 22nm 29.3TOPS/W End-to-End CIM-Utilization-Aware Accelerator with Reconfigurable 4D-CIM Mapping and Adaptive Feature Reuse for Diverse CNNs and Transformers. CICC 2025: 1-3 - 2024
- [j7]Qunsong Zeng, Jiawei Liu, Mingrui Jiang, Jun Lan, Yi Gong, Zhongrui Wang, Yida Li, Can Li, Jim Ignowski, Kaibin Huang:
Realizing In-Memory Baseband Processing for Ultrafast and Energy-Efficient 6G. IEEE Internet Things J. 11(3): 5169-5183 (2024) - [c8]Yingjie Zhu, Yiqing Lan, Humiao Li, Haoran Lyu, Zhen Kong, Jian Zhao, Yida Li, Guoxing Wang, Jiamin Li, Longyang Lin:
A 0.72nW, 0.006mm2 32kHz Crystal Oscillator with Adaptive Sub-Harmonic Pulse Injection from -40°C to 125°C in 22nm FDSOI. VLSI Technology and Circuits 2024: 1-2 - 2023
- [j6]Hasita Veluri, Umesh Chand, Yida Li, Baoshan Tang, Aaron Voon-Yew Thean:
A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array. IEEE Trans. Neural Networks Learn. Syst. 34(8): 4416-4427 (2023) - 2022
- [c7]Yiyang Zhang, Tianyi Wang, Jun Lan, Wenhui Wang, Longyang Lin, Yida Li:
Quantum Efficiency Enhancement in Si Avalanche Photodiodes in the NIR Regime via Surface Texturing Towards Autonomous Driving Applications. APCCAS 2022: 444-448 - [c6]Jinxuan Liang, Zhuoxuan Zhu, Yida Dong, Lei Lei, Yida Li, Mei Shen, X.-D. Xiang:
Simulation of Gap Structure Optical Waveguide with Phase Change Materials. APCCAS 2022: 454-457 - 2021
- [j5]Hasita Veluri, Yida Li, Jessie Xuhua Niu, Evgeny Zamburg, Aaron Voon-Yew Thean:
High-Throughput, Area-Efficient, and Variation-Tolerant 3-D In-Memory Compute System for Deep Convolutional Neural Networks. IEEE Internet Things J. 8(11): 9219-9232 (2021) - [j4]Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng:
A 70-μW 1.35-mm2 Wireless Sensor With 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver. IEEE J. Solid State Circuits 56(7): 2065-2076 (2021) - 2020
- [j3]Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng:
An 8.2- $\mu$ W 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter. IEEE J. Solid State Circuits 55(5): 1361-1373 (2020) - [j2]Bo Xiong, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng:
A $7\times7\times2$ mm3 8.6- $\mu$ W 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications. IEEE J. Solid State Circuits 55(6): 1698-1708 (2020) - [j1]Jieming Pan, Yuxuan Luo, Yida Li, Chen-Khong Tham, Chun-Huat Heng, Aaron Voon-Yew Thean:
A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-Based Gesture Recognition With AI at the Edge. IEEE Trans. Circuits Syst. II Express Briefs 67-II(9): 1624-1628 (2020) - [c5]Kamalika Datta, Arko Dutt, Ahmed Zaky, Umesh Chand, Devendra Singh, Yida Li, Jackson Chun-Yang Huang, Aaron Thean, Mohamed M. Sabry Aly:
Fledge: Flexible Edge Platforms Enabled by In-memory Computing. DATE 2020: 1181-1186 - [c4]Jieming Pan, Yida Li, Yuxuan Luo, Xiangyu Zhang, Zaifeng Yang, David Liang Tai Wong, Jessie Xuhua Niu, Chen-Khong Tham, Aaron Voon-Yew Thean:
Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance. IEEE SENSORS 2020: 1-4 - [c3]Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng:
23.2 A 70µW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver. ISSCC 2020: 346-348
2010 – 2019
- 2019
- [c2]Bo Xiong, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng:
A 7×7×2mm3 8.6-μ 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications. CICC 2019: 1-4 - [c1]Jessie Xuhua Niu, Hasita Veluri, Yida Li, Umesh Chand, Jin Feng Leong, Evgeny Zamburg, Maheswari Sivan, Aaron Voon-Yew Thean:
Design of Artificial Spiking Neuron with SiO2 Memristive Synapse to Demonstrate Neuron-Level Spike Timing Dependent Plasticity. ICICDT 2019: 1-3
Coauthor Index
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last updated on 2026-08-20 02:02 CEST by the dblp team
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