Pouya Asrar·Oct 25Where Diamond Goes in the Package MattersRecent cold-plate and device research makes the case for drawing the whole heat path before comparing cooling claims.
Pouya Asrar·Oct 23Boiling Coolant Needs an Exit RouteA new dielectric-cooling study shows why the vapor path — and the test conditions — belong beside the headline heat flux.
Pouya Asrar·Oct 22The Thermal Model Has to Keep Up With the PackageAn October study shows how reusable AI models could speed up chiplet design. The hard part is knowing when to trust them.
George Williams·Aug 11Space Is Freezing. So Why Is Cooling the Hardest Part?A deep dive into the first myth of data centers in space, and why “it’s cold up there, so cooling is free” gets the physics exactly…
