Taiwan's Role in Advanced Chip Packaging on Display at Semicon 2025

TaiwanPlus News

At Semicon 2025 in Taipei, industry leaders explained why advanced packaging is becoming the answer to wafer process bottlenecks, and why Taiwan remains the leading global hub for the technology.

Transcript

00:00As one of the world's largest chip trade shows in the world, Semicon opened on Wednesday,

00:12organizers highlighted Taiwan's role in critical semiconductor technologies.

00:17The country provides the vast majority of the world's most advanced chips,

00:21which power phones, PCs, and the AI boom.

00:24One big focus for the show has been advanced packaging for chips.

00:28But what is that?

00:30Most people know how many nanomani cameras are.

00:33For example, 5-3 nanomani cameras are not going to take 2 nanomani cameras.

00:37Group lifts up and increases the capacity from faltamian cameras.

00:41After the nanomani cameras are going to increase an 18-anomani cameras,

00:44it's necessary to get sort of snapshots to solve such problems.

00:48Modern chips are really a team of chips, compute, memory, and other parts on interconnected layers

00:56in an arrangement known as 2.5D, while so-called 3D packaging relies on vertical stacking of parts,

01:03bringing them closer for faster connections that use less power and space.

01:08There's still demand for chips getting smaller and cheaper, more efficient,

01:12especially now that AI is demanding more and more compute at a faster rate of improvement than ever before.

01:19And it's getting harder and harder at the same time to scale in the traditional way, which was 2D.

01:24Instead of making the floor plan smaller, why don't we add more floors to the skyscraper?

01:29Assembling and testing these tiny packages is highly technical, and AI demand has kept capacity tight.

01:35That's led some of Taiwan's chip-making giants like TSMC to expand their own capacity,

01:41aiming to more than double its popular Chip-on-Wafer-on-Substrate, or COOS, packaging output this year.

01:47It's outlined plans for two advanced packaging sites in the U.S. state of Arizona,

01:51while its American partner Amcor is also building a 2 billion U.S. dollar packaging plant in the state.

01:58Despite those expansions, Taiwan remains the most important location in the world

02:02for a packaging market expected to reach nearly 80 billion U.S. dollars by 2030,

02:08due to its localized ecosystem of the entire chip supply chain.

02:12Taiwan is the main focus to the world, based on no matter what you can see here,

02:35CMP, PVD, lithography, of course.

02:40And the reason why it's important, because TSMC helped them, or co-worked with them so much.

02:47So this company will kind of grow with so much talent, so much intelligence in them.

02:53That close-in supply chain, tools, materials, packaging, and talent in one place,

03:00is why Taiwan still holds the lead in semiconductors,

03:03even as designs grow more complex and power efficiency becomes central.

03:08This year's Semi-Con is focused on key technologies that are the building blocks of the next wave of computing,

03:15and how one country is determined to secure its place at the heart of it all.

03:20Alex Chun and Chris Gorin for Taiwan Plus.

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