A🔻atar of 🔻engeance@lemmy.mlEnglish · 17 days agoChip factories expected to help Vietnam master semiconductor technology – VNN [8 February 2026]plus-squarevietnamnet.vnexternal-linkmessage-square0linkfedilinkarrow-up17arrow-down10
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cm0002@infosec.pub · 1 month agoFujitsu taps Broadcom's 3D chip tech for 144-core Monaka CPUplus-squarewww.theregister.comexternal-linkmessage-square0linkfedilinkarrow-up12arrow-down10
arrow-up12arrow-down1external-linkFujitsu taps Broadcom's 3D chip tech for 144-core Monaka CPUplus-squarewww.theregister.comcm0002@infosec.pub · 1 month agomessage-square0linkfedilink
cm0002@infosec.pub · 1 month agoQualcomm Snapdragon X2E-96-100 Specsplus-squarewww.techpowerup.comexternal-linkmessage-square0linkfedilinkarrow-up12arrow-down11
arrow-up11arrow-down1external-linkQualcomm Snapdragon X2E-96-100 Specsplus-squarewww.techpowerup.comcm0002@infosec.pub · 1 month agomessage-square0linkfedilink
noumenon@lemmy.worldEnglish · 3 months agoTaiwan chipmaker TSMC begins 2nm chip volume productionplus-squaretechxplore.comexternal-linkmessage-square0linkfedilinkarrow-up15arrow-down11
arrow-up14arrow-down1external-linkTaiwan chipmaker TSMC begins 2nm chip volume productionplus-squaretechxplore.comnoumenon@lemmy.worldEnglish · 3 months agomessage-square0linkfedilink
cm0002@lemmy.zip · 6 months agoMushrooms show promise as memory chips for future computersplus-squarephys.orgexternal-linkmessage-square0linkfedilinkarrow-up113arrow-down10
arrow-up113arrow-down1external-linkMushrooms show promise as memory chips for future computersplus-squarephys.orgcm0002@lemmy.zip · 6 months agomessage-square0linkfedilink
cm0002@piefed.worldEnglish · 6 months agoSamsung takes a scalpel to its 2nm wafer price tag, bringing it down to $20,000 — Korean chipmaker now undercuts rival TSMC by 33%plus-squarewww.tomshardware.comexternal-linkmessage-square1linkfedilinkarrow-up113arrow-down10
arrow-up113arrow-down1external-linkSamsung takes a scalpel to its 2nm wafer price tag, bringing it down to $20,000 — Korean chipmaker now undercuts rival TSMC by 33%plus-squarewww.tomshardware.comcm0002@piefed.worldEnglish · 6 months agomessage-square1linkfedilink
ThorrJo@lemmy.sdf.orgEnglish · 7 months agoHow AMD is re-thinking Chiplet Design | High Yield [24:20]plus-squarewww.youtube.comexternal-linkmessage-square0linkfedilinkarrow-up11arrow-down10
arrow-up11arrow-down1external-linkHow AMD is re-thinking Chiplet Design | High Yield [24:20]plus-squarewww.youtube.comThorrJo@lemmy.sdf.orgEnglish · 7 months agomessage-square0linkfedilink
ThorrJo@lemmy.sdf.orgEnglish · 7 months agoThe Most Scalable Semiconductor | Asianometry [20:25]plus-squarewww.youtube.comexternal-linkmessage-square0linkfedilinkarrow-up15arrow-down10
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zth.jp@lemmy.world · 8 months agoJapan storms back into the chip warsplus-squarewww.economist.comexternal-linkmessage-square0linkfedilinkarrow-up16arrow-down10
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cm0002@lemmy.world · 8 months agoHow AI Will Impact Chip Design And Designersplus-squaresemiengineering.comexternal-linkmessage-square2linkfedilinkarrow-up16arrow-down10
arrow-up16arrow-down1external-linkHow AI Will Impact Chip Design And Designersplus-squaresemiengineering.comcm0002@lemmy.world · 8 months agomessage-square2linkfedilink
cm0002@lemmy.world · 8 months agoKioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiencyplus-squarewww.tomshardware.comexternal-linkmessage-square0linkfedilinkarrow-up11arrow-down10
arrow-up11arrow-down1external-linkKioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiencyplus-squarewww.tomshardware.comcm0002@lemmy.world · 8 months agomessage-square0linkfedilink
cm0002@lemmy.world · 8 months agoCost effective method developed for co-packaging photonic and electronic chipsplus-squaretechxplore.comexternal-linkmessage-square0linkfedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkCost effective method developed for co-packaging photonic and electronic chipsplus-squaretechxplore.comcm0002@lemmy.world · 8 months agomessage-square0linkfedilink
cm0002@lemmy.cafeEnglish · 9 months agoMichigan loses massive semiconductor plant. Whitmer blames ‘national economic turmoil’www.bridgemi.comexternal-linkmessage-square0linkfedilinkarrow-up119arrow-down10
arrow-up119arrow-down1external-linkMichigan loses massive semiconductor plant. Whitmer blames ‘national economic turmoil’www.bridgemi.comcm0002@lemmy.cafeEnglish · 9 months agomessage-square0linkfedilink
cm0002@lemmy.cafeEnglish · 9 months agoGlobalFoundries to make RISC-V CPUs — fab acquires MIPS, will integrate RISC-V and AI IP into its portfolioplus-squarewww.tomshardware.comexternal-linkmessage-square0linkfedilinkarrow-up19arrow-down10
arrow-up19arrow-down1external-linkGlobalFoundries to make RISC-V CPUs — fab acquires MIPS, will integrate RISC-V and AI IP into its portfolioplus-squarewww.tomshardware.comcm0002@lemmy.cafeEnglish · 9 months agomessage-square0linkfedilink
cm0002@lemmy.cafeEnglish · 9 months agoSamsung’s Taylor Facility Opening in the U.S. Reportedly Delayed To 2026 as the Korean Giant Struggles to Secure Customersplus-squarewccftech.comexternal-linkmessage-square0linkfedilinkarrow-up15arrow-down10
arrow-up15arrow-down1external-linkSamsung’s Taylor Facility Opening in the U.S. Reportedly Delayed To 2026 as the Korean Giant Struggles to Secure Customersplus-squarewccftech.comcm0002@lemmy.cafeEnglish · 9 months agomessage-square0linkfedilink
cm0002@lemmy.world · 9 months agoStruggling Semiconductor Firm Wolfspeed Files for Bankruptcyplus-squarewww.bloomberg.comexternal-linkmessage-square0linkfedilinkarrow-up17arrow-down10
arrow-up17arrow-down1external-linkStruggling Semiconductor Firm Wolfspeed Files for Bankruptcyplus-squarewww.bloomberg.comcm0002@lemmy.world · 9 months agomessage-square0linkfedilink
cm0002@lemmy.world · 10 months agoChip Industry Week in Reviewplus-squaresemiengineering.comexternal-linkmessage-square0linkfedilinkarrow-up14arrow-down11
arrow-up13arrow-down1external-linkChip Industry Week in Reviewplus-squaresemiengineering.comcm0002@lemmy.world · 10 months agomessage-square0linkfedilink
cm0002@lemmy.world · 10 months agoIntel vets break ranks to build the biggest, baddest CPUplus-squarewww.fudzilla.comexternal-linkmessage-square0linkfedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkIntel vets break ranks to build the biggest, baddest CPUplus-squarewww.fudzilla.comcm0002@lemmy.world · 10 months agomessage-square0linkfedilink
cm0002@lemmy.world · 10 months ago'Rising ASIC coalition' seeks to jettison Nvidia — Industry report claims firms are accelerating development in order to reduce dependence on the giant | Tom's Hardwareplus-squarewww.tomshardware.comexternal-linkmessage-square0linkfedilinkarrow-up14arrow-down10
arrow-up14arrow-down1external-link'Rising ASIC coalition' seeks to jettison Nvidia — Industry report claims firms are accelerating development in order to reduce dependence on the giant | Tom's Hardwareplus-squarewww.tomshardware.comcm0002@lemmy.world · 10 months agomessage-square0linkfedilink
cm0002@lemmy.world · 10 months agoArm retires Cortex brand, teases proprietary chip as RISC-V heat risesplus-squarewww.digitimes.comexternal-linkmessage-square2linkfedilinkarrow-up14arrow-down12
arrow-up12arrow-down1external-linkArm retires Cortex brand, teases proprietary chip as RISC-V heat risesplus-squarewww.digitimes.comcm0002@lemmy.world · 10 months agomessage-square2linkfedilink